Applications Of Ceramic Bond Diamond Abrasive Tools
Ceramic bond diamond abrasive tools have excellent performance. They have the characteristics of high hardness, high wear resistance, high thermal conductivity and sharp abrasive grains, etc. The characteristics such as heat resistance, water resistance, oil resistance, acid and alkali resistance make them not only have stronger grinding ability than ordinary abrasive grains, but also have less wear and longer service life, and can withstand grinding higher temperature, and at the same time has higher grinding accuracy. They can maintain a good shape for a long time and in addition, the ceramic bond diamond abrasive tools also have more pores, which can facilitate cooling and chip removal, and it is not easy to block and burn the workpiece during grinding. The ceramic bond diamond abrasive tools have good self-sharpening, long dressing interval, easy dressing and low maintenance cost. It is precisely because of the excellent performance of ceramic bond diamond abrasive tools, they have a very important application in industrial production.
Ceramic bond diamond abrasive tools are
widely used in practical applications, mainly due to their excellent
performance, which not only have the characteristics of diamond, but also
combines the characteristics of ceramic bonds, which compared with ordinary
corundum and SiC abrasives, have smaller grinding force and lower grinding
temperature, at the same time, they can maintain the shape well, and the
machining accuracy is also higher. In addition, because they have large pores,
it is conducive to chip holding and heat dissipation; they have good
self-sharpening and almost no need to be trimmed, so they are widely used all
over the world. The main application fields of ceramic bond diamond abrasive
tools include: rough grinding, fine grinding and ultra-fine grinding of diamond
tools, cubic nitrogen boron tools, cemented carbide and new engineering ceramic
materials, cermets, cast iron, and precious stones. And also grinding and
processing of concrete, refractory materials, crystalline materials,
fiber-reinforced plastics.
Diamond grinding tools are also
used in the grinding of PCD compacts. For the grinding of PCD tools, due to the
soft resin bond, the PCD tools that are ground are difficult to meet
the dimensional accuracy; the metal bond has poor self-sharpening ability due
to the strong bonding ability to the abrasive, and the heat generated by the metal bond grinding wheel is too high; considering the grinding efficiency, the
durability of the abrasive tool and the processing quality of the tool surface,
the ceramic bond diamond grinding wheel is the most suitable choice for
grinding PCD tools.
In addition, ceramic bond diamond abrasive tools can be used for precision machining of automobile crankshafts and hydraulic gear necks. It can also be used for rough grinding and fine grinding of TV picture tube fluorescent screens. High-performance silicon wafers for integrated circuits are processed with ceramic bond diamond abrasive tools, which have high processing accuracy and low processing roughness. And after processing and grinding, the silicon wafers have no metal ion pollution, and the qualified rate of processed products is high.
Ceramic bond diamond abrasive tools have many advantages, including high grinding precision, high efficiency, low temperature, etc., and have a long service life, good self-sharpening, acid and alkali resistance, corrosion resistance, precisely because of its excellent performance, so it has a very wide range of applications in the field of hard and brittle material processing.
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